Institute for Human Centered Engineering - microLab
Prof. Dr. Marcel Jacomet
T +41 32 321 62 41
Prof. Dr. Josef Goette
T +41 32 321 64 27
Prof. Dr. Theo Kluter
T +41 32 321 67 57
Prof. Dr. Lorenz Müller
T +41 32 321 64 69
Prof. Andreas Habegger
T +41 32 321 67 81
HuCE-microLab is equipped with a modern infrastructure including:
Fast electronic prototyping is a key issue in industrial and research projects. HuCE uses its fast prototyping infrastructure not only for internal projects but also gives access to SME to its modern infrastructure on a project basis.
The highlight in our ASIC testing and assembly line is the semi-automatic wire-bonder. In combination with the die-bonder, we can achieve a very high miniaturization by directly bonding our ASICs to various substrates, including PCBs.
With our low-volume SMD/BGA production line we offer fast electronic prototyping for R&D and for NPI (new product introduction). Some reference project we produced at our site.
The SP004 semiautomatic stencil printer makes it easy for the operator to print precise and reproducible fine structures. Stencil alignment is eased by the help of two vision cameras. All important parameters are machine controlled. PCB thickness from 0.5 to 5mm.
The FLX2011 pick & place is state of the art. It offers an extraordinary application range, ideal for R&D, low volume NPI and high-mix production. It features easy programming and set-up, and an intelligent feeder and inventory concept. The vision system allows to work with fine-pitch ICs down to 0.03mm and has a component range from 01005 to 50mm x 50mm.
Vapor phase soldering (VPS), also known as condensation soldering, provides accurate temperature profile during the soldering process. The process itself minimized oxidation during soldering. We have excellent process outputs with our VPS systems in Fine-Pitch BGA soldering due to the following process behaviors:
The RO-06-Plus is a prototyping oven with motorized drawer for automatic processing. The combo-heater system using convection/infrared ensures homogeneous temperature distribution and enables steep ramps. It has an integrated microprocessor for profile control and storage. To reduce oxidation during the soldering process the system operates with a Nitrogen atmosphere.